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Intel Xeon E3-1230 specifications
The specs can be used for short-term
listings on auction and classifieds sites
General information
Type
Market segment
Server
Family
Model number
E3-1230
CPU part numbers
CM8062307262610 is an OEM/tray microprocessor
BX80623E31230 is a boxed microprocessor
Frequency
3200 MHz
Maximum turbo frequency
3600 MHz (1 core)
3500 MHz (2 cores)
3400 MHz (3 cores)
3300 MHz (4 cores)
Bus speed
5 GT/s DMI
Clock multiplier
32
Package
1155-land Flip-Chip Land Grid Array (FCLGA 1155)
Socket
Socket 1155 / H2 / LGA1155
Size
1.48" x 1.48" / 3.75cm x 3.75cm
Introduction date
End-of-Life date
Last order date is December 27, 2013
Last shipment date for tray processors is December 5, 2014
Price at introduction
$215
S-spec numbers
Part number
ES/QS processors
Production processors
BX80623E31230
+
CM8062307262610
+
+
Architecture / Microarchitecture
Microarchitecture
Sandy Bridge
Platform
Bromolow
Processor core
Core stepping
D2 (Q1HQ, SR00H)
CPUID
206A7 (SR00H)
Manufacturing process
0.032 micron High-K metal gate process
Data width
64 bit
The number of CPU cores
4
The number of threads
8
Floating Point Unit
Integrated
Level 1 cache size
4 x 32 KB 8-way set associative instruction caches
4 x 32 KB 8-way set associative data caches
Level 2 cache size
4 x 256 KB 8-way set associative caches
Level 3 cache size
8 MB 16-way set associative shared cache
Physical memory
32 GB
Multiprocessing
Uniprocessor
Features
MMX instructions
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSSE3 / Supplemental Streaming SIMD Extensions 3
SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
AES / Advanced Encryption Standard instructions
AVX / Advanced Vector Extensions
EM64T / Extended Memory 64 technology / Intel 64
NX / XD / Execute disable bit
VT-x / Virtualization technology
VT-d / Virtualization for directed I/O
TBT 2.0 / Turbo Boost technology 2.0
TXT / Trusted Execution technology
HT / Hyper-Threading technology
Low power features
C1, C3 and C6 thread states
C1/C1E, C3 and C6 core states
C1/C1E, C3 and C6 package states
Enhanced SpeedStep technology
Integrated peripherals / components
Integrated graphics
None
Memory controller
The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-1066, DDR3-1333
Maximum memory bandwidth (GB/s): 21.3
ECC supported: Yes
Other peripherals
Direct Media Interface 2.0
PCI Express 2.0 interface
Electrical / Thermal parameters
Minimum/Maximum operating temperature
5°C - 69.1°C
Minimum power dissipation
5.5 Watt (C6 state)
Thermal Design Power
80 Watt
Kilmės | KN(Kilmės) |
Suderinamos Prekės | "APPLE" |
Serija | PAVILJONAS |
Modelio Numeris | Intel Xeon E3-1230 |
Prekės Pavadinimas | VIRIVI |
Prekės Būklė | Panaudota |
Sertifikavimo | Nėra |